Product Name:YH Microetch Leveler

Solution Composition & Operating Parameters:

YH-208: 20-175 g/L 

Sulfuric Acid: 2-5 % 

Temperature: 25-40℃ 

Treatment Time: Spray: 45-80s Dip: 2-3 min

Features and Applications:

1、Uniform and controllable etching rate, good gloss and adhesion performance, easy operation.

2、Micro-etching reaction is not affected by copper ion concentration. The etching amount and roughening effect can be adjusted as required.

3、High solubility and fast dissolution rate for convenient bath preparation. Easy rinsing after etching with minimal residual.

4、Stable chemical properties; solid form for simple storage. Long service life and stable working solution.

5、Simple formulation without chelating agents, facilitating waste liquid treatment.

Specification:

25KG plastic drum