Product Name:YH-605 Microetch Stabilizer

Solution Composition & Operating Parameters:

Sulfuric Acid: 90-110 mL/L 

Hydrogen Peroxide: 70-90 mL/L 

Temperature: Ambient Time: 1-2 min 

YH-605: For Electroless Copper: 10-50 mL/L

 For Pattern Plating: 10-60 mL/L

Features and Applications:

1、Applied prior to electroless copper and electroplating copper processes. It cleans and micro-roughens copper surfaces to achieve strong adhesion for subsequent deposits.

2、Maintains consistent etching rate, enables copper regeneration and supports high copper dissolution capacity. No additional acid pickling is required.

Specification:

25KG plastic drum