Product Name:Alkaline Etching Additive

Solution Composition & Operating Parameters:

Ammonium Chloride: 225-275 g/L 

Ammonium Bicarbonate: 20-25 g/L 

20% Ammonia Water: 400-425 g/L 

Alkaline Etching Additive: 5 g/L

Features and Applications:

1、Fast and stable etching rate with wide compatibility. Suitable for various resist layers such as gold, nickel, tin, lead-tin alloy, liquid photoresist and dry film photoresist.

2、High copper etching capacity and minimal undercut. Formulated with multiple active components to suppress side etching to the maximum extent.

3、Simple post-rinsing process, reducing defects like short circuits and solder mask blistering caused by incomplete cleaning.

4、Single-component solution with excellent stability, low tendency of crystallization and precipitation. The mother liquor can be easily recovered with electrolytic recovery equipment to realize recycling of etching waste solution.

5、Low or sulfur-free formula to mitigate discoloration on gold-plated boards.

Specification:
25KG plastic drum