Product Name:YH-200 Through Hole Filling Brightener (Soluble Anode)

Solution Composition & Operating Parameters:

Pre-dip: YH-200Y Pre-dip Agent: 10-12 %, 

Temperature: 20-27℃, 

Time: 4-6 min Electroplating: Copper Sulfate: 180-210 g/L 

Sulfuric Acid: 90-110 g/L 

Chloride Ion: 60-80 ppm 

YH-200W Wetting Agent: 8-20 mL/L 

YH-200B Brightener: 0.6-1.5 mL/L 

YH-200M Leveling Make-up Agent: 6-15 mL/L 

Temperature: 20-26℃ 

Current Density: 0.4-4 A/dm²

Features and Applications:

1、Capable of filling blind vias of various structures while plating through holes simultaneously. It deposits a bright, fine-grained copper layer with excellent ductility and physical properties on substrates.

2、Fills blind vias while reducing copper thickness on the panel. This process shortens operation cycles and eliminates extra planarization steps. It supports mixed plating of through holes and blind vias as well as partial copper filling.

Specification:

25KG plastic drum