Product Name:YH-813N High Speed Copper Plating

Solution Composition & Operating Parameters:

Copper Sulfate: 55-75 g/L 

Sulfuric Acid: 10-13 g/L 

Chloride Ion: 40-70 ppm 

YH-813M: 5 mL/L 

YH-813R: 0.3-1.5 mL/L 

YH-813C: 1 mL/L 

Temperature: 22-26℃

Features and Applications:

1、Produces bright, fine-grained copper deposits with excellent ductility and uniform copper thickness distribution across the panel.

2、The deposit maintains good physical properties.

3、Stable plating bath with a wide operating window.

Specification:

25KG plastic drum