Product Name:YH-290A High Speed Copper Plating

Solution Composition & Operating Parameters:
Copper Sulfate: 200-240 g/L 

Sulfuric Acid: 30-40 mL/L 

Chloride Ion: 30-70 ppm 

YH-290A: 2.5-10 mL/L 

Temperature: 20-35℃ 

Current Density: 0.1-4 A/dm²

Features and Applications:

1、The copper deposit features low internal stress, excellent ductility and superior throwing power.

2、The plating bath has high tolerance to impurities, eliminating frequent activated carbon treatment.

Specification:

25KG plastic drum