Product Name:YH-603 OSP Organic Solderability Preservative

Solution Composition and Operating Parameters:

YH-603: Use as supplied 

Temperature: 35-42°C 

Treatment Time: 60 s

Features and Applications:

1、Low-cost surface treatment technology.

2、Uniform protective film delivers flat pad surface.

3、Low surface ionic contamination.

4、Film forms selectively only on copper surfaces.

5、Excellent heat resistance, maintaining good solderability after multiple reflow cycles.

6、Great moisture resistance, offering up to one-year copper protection.

7、Water-soluble solution without non-volatile solvents, high safety.

Specification:

25KG Plastic Drum