Product Name:YH-EAIS Anti-Silver Displacement Additive

Solution Composition and Operating Parameters:

YH-EAIS: 1-5 % 

Potassium Cyanide: 0.1 g/L 

Potassium Silver Cyanide: 0.1 g/L 

Temperature: 25°C 

Treatment Time: 5-20 s

pH: 11.4

Features and Applications:

1、Forms an anti-displacement film on copper and copper alloy substrates to effectively prevent silver immersion displacement.

2、Widely used for semiconductor IC lead frames.

Specification:

25KG Plastic Drum