Product Name:YH Electroless Silver

Solution Composition and Operating Parameters:

Silver Content: 0.6-1.2 g/L 

Chelating Agent: 0.02-0.04M 

Acid Normality: 0.1-0.3N 

YH Electroless Silver A: 30 mL/L 

YH Electroless Silver B: 200 mL/L 

Temperature: 48-56°C 

Treatment Time: 0.5-1 minute

Features and Applications:

1、Suitable for depositing uniform and dense silver layers on various copper substrates. It effectively protects copper surfaces and provides proper electrical conductivity, solderability and corrosion resistance.

2、Controllable silver thickness and stable bath solution. The silver deposit is bright and compact. When used together with silver protectant, it achieves outstanding corrosion resistance.

Specification:25KG Plastic Drum