Product Name:YH-330 Dye-Free Acid Copper Additive (High Leveling)

Solution Composition and Operating Parameters:

Copper Sulfate: 200-220 g/L 

Sulfuric Acid: 27-38 mL/L 

Chloride Ion: 75-150 ppm 

Ferrous Sulfate: 0.5 g/L 

YH-330 Grain Refiner: 1.5 mL/L 

YH-330 Brightener: 0.8 mL/L 

YH-330 Leveling Agent: 0.3 mL/L 

Temperature: 21-32°C 

Anode Current Density: 0.5-2 A/dm²

Features and Applications:

1、No decomposition by-products generated.

2、No sediment formation.

3、The deposit delivers excellent brightness and leveling performance across the entire current density range.

4、Low coating stress and high ductility, suitable for all metal plating and plastic plating applications.

Specification:

25KG Plastic Drum