Product Name:YH-AGPREP Lead Frame Silver Surface Adhesion Promoter

Solution Composition and Operating Parameters:

YH-AGPREP: 400-600 mL/L 

Temperature: 45°C Treatment 

Time: 30-60 seconds Current Density: 8-16 A/dm²

Features and Applications:

1、Enhances adhesion between molding compound resin and silver metal surfaces, serving as an electrolytic adhesion promoter for the lead frame industry.

2、It is a packaging bonding enhancement process without surface micro-etching. This treatment will not cause any modification to the silver surface.

Specification:

25KG Plastic Drum